Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230937 | Semiconductor device and a manufacturing method thereof | Kaori Sumitomo, Hiroshi Horibe, Yasuki Takata | 2016-01-05 |
| 8881966 | Method of manufacturing semiconductor device, and wire bonder | Kazuyuki Misumi, Shunji Yamauchi, Mitsuru Aoki | 2014-11-11 |
| 8415245 | Method of manufacturing semiconductor device and semiconductor device | Yasuki Takata, Kaori Sumitomo, Hiroshi Horibe | 2013-04-09 |
| 7943433 | Method of manufacturing semiconductor device | — | 2011-05-17 |
| 7763966 | Resin molded semiconductor device and differential amplifier circuit | Kazuyuki Misumi, Kazushi Hatauchi, Yasuki Takata, Naoya Yasuda, Katsuyuki Fukudome | 2010-07-27 |
| 7659635 | Semiconductor device and method of manufacturing the same | Hidetoshi Kuraya, Fumiaki Aga | 2010-02-09 |
| 7622799 | Semiconductor device, interposer chip and manufacturing method of semiconductor device | Soshi Kuroda, Naoya Yasuda, Akira Yamazaki, Koji Bando | 2009-11-24 |
| 7456091 | Semiconductor device and method of manufacturing the same | Hidetoshi Kuraya, Fumiaki Aga | 2008-11-25 |
| 6774494 | Semiconductor device and manufacturing method thereof | — | 2004-08-10 |
| 6564989 | Wire bonding method and wire bonding apparatus | — | 2003-05-20 |
| 5132330 | Method for manufacturing expandable styrene type polymer particles | Yuichi Ueda, Kiyoshi Mori, Toshiaki Sugita | 1992-07-21 |