Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5932923 | Semiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulate | Tae Hyeong Kim, In Sik Cho, Gi Su Yoo, Sang-Hyeop Lee | 1999-08-03 |
| 5811132 | Mold for semiconductor packages | Hee-Kook Choi, In Sik Cho, Tae-Sung Park | 1998-09-22 |