Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8620164 | Hybrid III-V silicon laser formed by direct bonding | John Heck, Richard Jones, Hyundai Park | 2013-12-31 |
| 7924122 | Collapsible contact switch | Tsung-Kuan A. Chou | 2011-04-12 |
| 7898371 | Electromechanical switch with partially rigidified electrode | Tsung-Kuan A. Chou | 2011-03-01 |
| 7734123 | Evanescent III-V silicon photonics device with spin coat bonding | Richard Jones | 2010-06-08 |
| 7705699 | Collapsible contact switch | Tsung-Kuan A. Chou | 2010-04-27 |
| 7605675 | Electromechanical switch with partially rigidified electrode | Tsung-Kuan A. Chou | 2009-10-20 |
| 7362199 | Collapsible contact switch | Tsung-Kuan A. Chou | 2008-04-22 |
| 7321275 | Ultra-low voltage capable zipper switch | Tsung-Kuan A. Chou, Quan Tran, Joseph Melki, John Heck, Qing Ma | 2008-01-22 |
| 7283024 | MEMS switch stopper bumps with adjustable height | John Heck | 2007-10-16 |
| 7118935 | Bump style MEMS switch | — | 2006-10-10 |