Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266613 | Electronic device comprising a package provided with an interconnection structure | Claire Laporte, Laurent Schwartz | 2025-04-01 |
| 11270894 | Manufacturing method for semiconductor package with cantilever pads | Jefferson Talledo | 2022-03-08 |
| 9899236 | Semiconductor package with cantilever pads | Jefferson Talledo | 2018-02-20 |
| 9824979 | Electronic package having electromagnetic interference shielding and associated method | Frederick Arellano, Michael Tabiera | 2017-11-21 |
| 9768126 | Stacked semiconductor packages with cantilever pads | Jefferson Talledo | 2017-09-19 |
| 9627224 | Semiconductor device with sloped sidewall and related methods | Jefferson Talledo | 2017-04-18 |