Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276632 | Semiconductor package | Chang Yong Jo, Young Mo Lee, Jung Sic Oh, Jong Ho HAN | 2022-03-15 |
| 8421211 | Wafer level semiconductor package and fabrication method thereof | In Soo Kang, Byoung-Yool Jeon | 2013-04-16 |
| 8237276 | Bump structure and fabrication method thereof | Chi-Jung Song, In Soo Kang, Yun Mook Park, Eung Ju Lee, Jun Kyu Lee +1 more | 2012-08-07 |
| 7952210 | Semiconductor package and fabrication method thereof | In Soo Kang, Jong-Heon Kim, Seung Dae Baek | 2011-05-31 |
| 7808095 | Ultra slim semiconductor package and method of fabricating the same | — | 2010-10-05 |