Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581241 | Circuit modules with front-side interposer terminals and through-module thermal dissipation structures | Boon Yew Low, Fernando A. Santos, Li Li, Lan Chu Tan | 2023-02-14 |
| 9209081 | Semiconductor grid array package | Weng F. Yap | 2015-12-08 |
| 8941194 | Pressure sensor device having bump chip carrier (BCC) | Wai Yew Lo | 2015-01-27 |
| 8546169 | Pressure sensor device and method of assembling same | Wai Yew Lo | 2013-10-01 |