Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11678441 | Manufacturing method of circuit carrier board structure | Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Ra-Min Tain | 2023-06-13 |
| 11037869 | Package structure and preparation method thereof | Chun-Hsien Chien, Cheng-Hui Wu, Wei-Ti Lin | 2021-06-15 |
| 11032917 | Circuit carrier board and manufacturing method thereof | Wei-Ti Lin, Chun-Hsien Chien | 2021-06-08 |
| 10950687 | Manufacturing method of substrate structure | Yu-Hua Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin | 2021-03-16 |
| 10888001 | Circuit carrier board structure and manufacturing method thereof | Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Ra-Min Tain | 2021-01-05 |
| 10886264 | Manufacturing method of light-emitting diode package structure | Wei-Ti Lin, Chun-Hsien Chien | 2021-01-05 |
| 10700049 | Light-emitting diode package structure and manufacturing method thereof | Wei-Ti Lin, Chun-Hsien Chien | 2020-06-30 |
| 10700161 | Substrate structure and manufacturing method thereof | Yu-Hua Chen, Chun-Hsien Chien, Chien-Chou Chen, Wei-Ti Lin | 2020-06-30 |
| 10123418 | Circuit board structure and manufacturing method thereof | Wei-Ti Lin, Chun-Hsien Chien | 2018-11-06 |