Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7102209 | Substrate for use in semiconductor manufacturing and method of making same | Jaime A. Bayan, Ashok S. Prabhu | 2006-09-05 |
| 6173490 | Method for forming a panel of packaged integrated circuits | Shaw Wei Lee, Hem Takiar | 2001-01-16 |
| 4804810 | Apparatus and method for tape bonding | James W. Clark | 1989-02-14 |