Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368116 | Electronic package and manufacturing method thereof | Lung-Yuan Wang | 2025-07-22 |
| 12283560 | Electronic package including electronic structure and electronic body and manufacturing method thereof | Lung-Yuan Wang | 2025-04-22 |
| 12009340 | Method for fabricating electronic package | Lung-Yuan Wang, Mao-Hua Yeh | 2024-06-11 |
| 11984393 | Electronic package, manufacturing method for the same, and electronic structure | Lung-Yuan Wang | 2024-05-14 |
| 11973047 | Electronic package including electronic structure and electronic component | Lung-Yuan Wang | 2024-04-30 |
| 11709133 | Solid surface wettability determination method | Jen-You Chu, Yun-Hsin Wang, Siou-Cheng Lou | 2023-07-25 |
| 11326997 | Surface wettability determination method | Jen-You Chu, Yun-Hsin Wang | 2022-05-10 |
| 11152331 | Electronic package and method for fabricating the same | Lung-Yuan Wang, Mao-Hua Yeh | 2021-10-19 |
| 10723893 | Composite structure | Jen-You Chu, Chia-Le Wu, Chin-Ping HUANG, Yi-Chun Chen | 2020-07-28 |
| 10012646 | Sensing chip | Ding-Zheng Lin, Ting-Yu Shih, Ping-Chen Chen, Jen-You Chu | 2018-07-03 |
| 10006934 | Method for determining antifouling ability of a material surface and determining device for determining antifouling ability of material surface | Jen-You Chu | 2018-06-26 |