Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5059553 | Metal bump for a thermal compression bond and method for making same | Gobinda Das, Thomas L. Viau | 1991-10-22 |
| 5053851 | Metal bump for a thermal compression bond and method for making same | Gobinda Das, Thomas L. Viau | 1991-10-01 |
| 4346343 | Power control means for eliminating circuit to circuit delay differences and providing a desired circuit delay | Jack A. Dorler, Joseph M. Mosley, Stephen Douglas Weitzel | 1982-08-24 |
| 4323914 | Heat transfer structure for integrated circuit package | Bernard Clark, Jack A. Dorler | 1982-04-06 |