Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341130 | Method of thinning a semiconductor die | Meiqin Hao, Izzie Zhang, Thierry Du, Maggie Deng, Bo Fu +1 more | 2025-06-24 |
| 11942459 | Semiconductor device package with exposed bond wires | Hua Tan, Hope Chiu, Weiting Jiang, Cong Zhang, Simon Dong +2 more | 2024-03-26 |