Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6776893 | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect | Paul R. Gerst, Vincent Paneccasio, Jr., Richard Hurtubise | 2004-08-17 |
| 6024856 | Copper metallization of silicon wafers using insoluble anodes | Juan Haydu, Richard Hurtubise | 2000-02-15 |
| 5415685 | Electroplating bath and process for white palladium | Vincent Paneccasio, Jr. | 1995-05-16 |
| 4483739 | Compositions and method for stripping gold from copper substrates | Daniel R. Marx | 1984-11-20 |