EB

Edward G. Bundga

IBM: 3 patents #26,272 of 70,183Top 40%
📍 Endicott, NY: #211 of 620 inventorsTop 35%
🗺 New York: #38,318 of 115,490 inventorsTop 35%
Overall (All Time): #1,617,433 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6425772 Conductive adhesive having a palladium matrix interface between two metal surfaces William E. Bernier 2002-07-30
6331119 Conductive adhesive having a palladium matrix interface between two metal surfaces William E. Bernier 2001-12-18
5281150 Method and apparatus for connecting cable to the surface of printed circuit boards or the like Michael D. Dinardo, Jeffrey Alan Knight, Louis J. Konrad, III 1994-01-25