Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417965 | Interconnect for IC package | Ruby Ann Merto Camenforte, Floro Lopez Camenforte, III | 2025-09-16 |
| 12341126 | Bump to package substrate solder joint | Michael Flores Milo, Allen Dee | 2025-06-24 |
| 12136587 | Lead frame for a die | Cherry Lyn Marquez Aranas | 2024-11-05 |
| 11881434 | Semiconductor die singulation | Connie Alagadan Esteron | 2024-01-23 |
| 11749621 | Leadframe with ground pad cantilever | Ernesto Pentecostes Rafael, Jr., Michael Flores Milo | 2023-09-05 |
| 11742318 | Split tie bar for clip stability | Ernesto Pentecostes Rafael, Jr., Michael Flores Milo | 2023-08-29 |
| 11538768 | Leadframe with ground pad cantilever | Ernesto Pentecostes Rafael, Jr., Michael Flores Milo | 2022-12-27 |
| 11239130 | Selective molding for integrated circuit | Floro Lopez Camenforte, III, Joe Anne Feive Carbonell Lopez | 2022-02-01 |
| 11211320 | Package with shifted lead neck | Joe Ann Feive Carbonell Lopez, Gloria Bibal Manaois, Kevin John Bersamira Delos Santos | 2021-12-28 |
| 11049800 | Semiconductor device package with grooved substrate | Cherry Lyn Marquez Aranas | 2021-06-29 |
| 10991621 | Semiconductor die singulation | Connie Alagadan Esteron | 2021-04-27 |
| 10964629 | Siderail with mold compound relief | Richard Diestro Sumalinog, Ruby Ann Merto Camenforte, Sylvester Tigno Sanchez | 2021-03-30 |
| 10872785 | QFN pin routing thru lead frame etching | Cherry Lyn Marquez Aranas | 2020-12-22 |
| 10811292 | Transport packaging and method for expanded wafers | Connie Alagadan Esteron, Jerry Gomez Cayabyab | 2020-10-20 |
| 10573583 | Semiconductor device package with grooved substrate | Cherry Lyn Marquez Aranas | 2020-02-25 |
| 10439313 | Integrated circuit (IC) chip socket | Michael Flores Milo | 2019-10-08 |
| 10361098 | QFN pin routing thru lead frame etching | Cherry Lyn Marquez Aranas | 2019-07-23 |
| 9824959 | Structure and method for stabilizing leads in wire-bonded semiconductor devices | Mark Gerald Rosario Pinlac, Bobby Johns Lansangan Villacarlos, Jerry Gomez Cayabyab, Juan Carlo Aro Rimando | 2017-11-21 |
| 9761536 | Angle referenced lead frame design | Ernesto Pentecostes Rafael, Jr. | 2017-09-12 |
| 9748686 | BGA spring probe pin design | Michael Flores Milo | 2017-08-29 |