Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417965 | Interconnect for IC package | Floro Lopez Camenforte, III, Dolores Babaran Milo | 2025-09-16 |
| 11855027 | Integrated circuits with conductive bumps having a profile with a wave pattern | Jose Daniel Carlos Torres | 2023-12-26 |
| 10964629 | Siderail with mold compound relief | Dolores Babaran Milo, Richard Diestro Sumalinog, Sylvester Tigno Sanchez | 2021-03-30 |
| 10847483 | Integrated circuits with conductive bumps having a profile with a wave pattern | Jose Daniel Carlos Torres | 2020-11-24 |
| 9698085 | Leadframe strip assembly and method of processing | Rex Araneta Cari-an, Roxanna Bauzon Samson, Glenn Juan Morado | 2017-07-04 |