Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341126 | Bump to package substrate solder joint | Dolores Babaran Milo, Allen Dee | 2025-06-24 |
| 11749621 | Leadframe with ground pad cantilever | Ernesto Pentecostes Rafael, Jr., Dolores Babaran Milo | 2023-09-05 |
| 11742318 | Split tie bar for clip stability | Dolores Babaran Milo, Ernesto Pentecostes Rafael, Jr. | 2023-08-29 |
| 11538768 | Leadframe with ground pad cantilever | Ernesto Pentecostes Rafael, Jr., Dolores Babaran Milo | 2022-12-27 |
| 10439313 | Integrated circuit (IC) chip socket | Dolores Babaran Milo | 2019-10-08 |
| 9748686 | BGA spring probe pin design | Dolores Babaran Milo | 2017-08-29 |