Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4734753 | Thermocompression bonding of copper leads to a metallized ceramic substrate | Benjamin H. Cranston, Richard L. Hunsberger | 1988-03-29 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4734753 | Thermocompression bonding of copper leads to a metallized ceramic substrate | Benjamin H. Cranston, Richard L. Hunsberger | 1988-03-29 |