Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5225966 | Conductive adhesive film techniques | Nagesh R. Basavanhally | 1993-07-06 |
| 4902857 | Polymer interconnect structure | Lloyd Shepherd | 1990-02-20 |
| 4734753 | Thermocompression bonding of copper leads to a metallized ceramic substrate | Richard L. Hunsberger, Donald A. Machusak | 1988-03-29 |
| 4563811 | Method of making a dual-in-line package | — | 1986-01-14 |