Richard L. Hunsberger

AT AT&T: 1 patents #10,626 of 18,772Top 60%

AT American Telephone And Telegraph: 1 patents #132 of 699Top 20%

📍 Laureldale, PA: #35 of 57 inventorsTop 65%

🗺 Pennsylvania: #43,221 of 74,527 inventorsTop 60%

Overall (All Time): #3,949,230 of 4,157,543Top 95%

Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
4734753	Thermocompression bonding of copper leads to a metallized ceramic substrate	Benjamin H. Cranston, Donald A. Machusak	1988-03-29