Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9095084 | Stacked multilayer structure | Ting-Hao Lin, Yu-Te Lu | 2015-07-28 |
| 9095085 | Method of manufacturing a stacked multilayer structure | Ting-Hao Lin, Yu-Te Lu | 2015-07-28 |
| 8941224 | Package structure of a chip and a substrate | Ting-Hao Lin, Yu-Te Lu | 2015-01-27 |
| 8887386 | Method of manufacturing a chip support board structure | Ting-Hao Lin, Yu-Te Lu | 2014-11-18 |
| 8875390 | Method of manufacturing a laminate circuit board | Ting-Hao Lin, Yu-Te Lu | 2014-11-04 |
| 8766102 | Chip support board structure | Ting-Hao Lin, Yu-Te Lu | 2014-07-01 |
| 8312624 | Method for manufacturing a heat dissipation structure of a printed circuit board | Chien-Wei Chang, Ting-Hao Lin, Ya-Hsiang Chen | 2012-11-20 |