Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437333 | Packaged semiconductor device with a reflow wall | Vikas Gupta | 2022-09-06 |
| 11062982 | Packaged semiconductor device with a particle roughened surface | Vikas Gupta | 2021-07-13 |
| 10573586 | Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer | Benjamin Stassen Cook | 2020-02-25 |
| 10475729 | Packaged semiconductor device with a particle roughened surface | Vikas Gupta | 2019-11-12 |
| 10186478 | Packaged semiconductor device with a particle roughened surface | Vikas Gupta | 2019-01-22 |
| 9941194 | Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer | Benjamin Stassen Cook | 2018-04-10 |