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Method of controlling outdiffusion in a doped three-dimensional film |
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Apparatus having low resistance angled implant regions |
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2001-11-20 |
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Method of controlling outdiffusion in doped three-dimensional film by using angled implants |
Fernando Gonzalez, D. Mark Durcan, Luan C. Tran, Robert Kerr, Howard E. Rhodes |
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Method of reducing outdiffusion from a doped three-dimensional polysilicon film into substrate by using angled implants |
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Method of forming an electrically conductive substrate interconnect continuity region with an angled implant |
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1999-11-02 |
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Electrically conductive substrate interconnect continuity region and method of forming same with an angled implant |
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1999-01-12 |
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Method for making a fillet for integrated circuit metal plug |
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Electrically conductive substrate interconnect continuity region and method of forming same with an angled implant |
— |
1995-01-03 |
