Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8264846 | Ceramic package substrate with recessed device | Christopher C. Jones, Timothe Litt, Larry Binder, Kaladhar Radhakrishnan, Cengiz A. Palanduz | 2012-09-11 |
| 6812485 | Dual interposer packaging for high density interconnect | Sharad M. Shah, Angelo Villani, Nicholas Palmer | 2004-11-02 |