Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705396 | Method to form air gap structure with dual dielectric layer | Vincent J. McGahay, Ju Jin An, Tim H. Lee, Todd J. Van Kleeck | 2023-07-18 |
| 11127678 | Dual dielectric layer for closing seam in air gap structure | Vincent J. McGahay, Ju Jin An, Tim H. Lee, Todd J. Van Kleeck | 2021-09-21 |
| 6150707 | Metal-to-metal capacitor having thin insulator | Robert K. Cook, Mark A. Passaro, Frederick A. Scholl | 2000-11-21 |
| 6069051 | Method of producing planar metal-to-metal capacitor for use in integrated circuits | Du Nguyen, Hazara S. Rathore, George S. Prokop, Richard A. Wachnik | 2000-05-30 |
| 6001702 | Metal to metal capacitor and method for producing same | Robert K. Cook, Mark A. Passaro, Frederick A. Scholl | 1999-12-14 |