| 9064973 |
Die attached to a support member by a plurality of adhesive members |
John C. Fernandez |
2015-06-23 |
| 8278751 |
Methods of adhering microfeature workpieces, including a chip, to a support member |
John C. Fernandez |
2012-10-02 |
| 7518237 |
Microfeature systems including adhered microfeature workpieces and support members |
John C. Fernandez |
2009-04-14 |
| 6921017 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Sven Evers |
2005-07-26 |
| 6652138 |
Semiconductor wire bond machine leadframe thermal map system |
— |
2003-11-25 |
| 6634538 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Sven Evers |
2003-10-21 |
| 6588649 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Sven Evers |
2003-07-08 |
| 6447162 |
Semiconductor wirebond machine leadframe thermal map system |
— |
2002-09-10 |
| 6375061 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Sven Evers |
2002-04-23 |
| 6352191 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Sven Evers |
2002-03-05 |
| 6273605 |
Semiconductor wirebond machine leadframe thermal map system |
— |
2001-08-14 |
| 6138891 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Sven Evers |
2000-10-31 |
| 6126062 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Sven Evers |
2000-10-03 |
| 6105846 |
Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits |
Sven Evers |
2000-08-22 |
| 6071009 |
Semiconductor wirebond machine leadframe thermal map system |
— |
2000-06-06 |
