Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12050350 | Semiconductor package structure and method of manufacturing the same | Yu-Yuan Yeh, Jun-Wei Chen | 2024-07-30 |
| 11835757 | Optoelectronic package and method for manufacturing the same | Mei-Ju Lu, Jr-Wei LIN | 2023-12-05 |
| 11474301 | Device for communication | Jr-Wei LIN, Chieh-Chen Fu, Kao-Ming Su, Chen Yuan Weng | 2022-10-18 |