Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496146 | Method for forming through-base wafer vias | Yuzhuo Li, Daniel Kwo-Hung Shen | 2016-11-15 |
CW
Changxue Wang
Overall (All Time): #3,027,248 of 4,157,543Top 75%
1
Patents All Time