Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7534719 | Method for reduction in metal dishing after CMP | Rebecca A. Nickell, Todd H. Gandy | 2009-05-19 |
| 7372160 | Barrier film deposition over metal for reduction in metal dishing after CMP | Rebecca A. Nickell, Todd H. Gandy | 2008-05-13 |
| 6455412 | Semiconductor contact via structure and method | Fu-Tai Liou | 2002-09-24 |
| 6037623 | Polycrystalline silicon resistors for integrated circuits | — | 2000-03-14 |
| 6010959 | Method of improving photoresist adhesion on a dielectric layer | John C. Sardella, Alexander Kalnitsky, Robert Carlton Foulks, Sr. | 2000-01-04 |
| 5825060 | Polycrystalline silicon resistors for intergrated circuits | — | 1998-10-20 |
| 5627104 | Method to improve interlevel dielectric planarization using SOG | Frank R. Bryant | 1997-05-06 |
| 5593920 | Method for forming contact structures in integrated circuits | Michael E. Haslam | 1997-01-14 |
| 5594269 | Resistive load for integrated circuit devices | Fu-Tai Liou | 1997-01-14 |
| 5462894 | Method for fabricating a polycrystalline silicon resistive load element in an integrated circuit | Fu-Tai Liou | 1995-10-31 |
| 5331116 | Structure and method for forming contact structures in integrated circuits | Michael E. Haslam | 1994-07-19 |
| 5331117 | Method to improve interlevel dielectric planarization | Frank R. Bryant | 1994-07-19 |
| 5321211 | Integrated circuit via structure | Michael E. Haslam | 1994-06-14 |
| 5268325 | Method for fabricating a polycrystalline silicon resistive load element in an integrated circuit | Fu-Tai Liou | 1993-12-07 |
| 5151376 | Method of making polycrystalline silicon resistors for integrated circuits | — | 1992-09-29 |
| 5146309 | Method for forming polycrystalline silicon contacts | Fusen Chen, Fu-Tai Liou | 1992-09-08 |
| 5070391 | Semiconductor contact via structure and method | Fu-Tai Liou | 1991-12-03 |
| 5068201 | Method for forming a high valued resistive load element and low resistance interconnect for integrated circuits | Fu-Tai Liou | 1991-11-26 |
| 5059554 | Method for forming polycrystalline silicon contacts | Fusen F. Chen, Fu-Tai Liou | 1991-10-22 |