| 6010959 |
Method of improving photoresist adhesion on a dielectric layer |
Alexander Kalnitsky, Charles R. Spinner, III, Robert Carlton Foulks, Sr. |
2000-01-04 |
| 5903054 |
Integrated circuit with improved pre-metal planarization |
— |
1999-05-11 |
| 5877541 |
Contact structure for improving photoresist adhesion on a dielectric layer |
Alexander Kalnitsky, Charles R. Spinner III, Robert Carlton Foulks, Sr. |
1999-03-02 |
| 5869175 |
Integrated circuit structure having two photoresist layers |
— |
1999-02-09 |
| 5856707 |
Vias and contact plugs with an aspect ratio lower than the aspect ratio of the structure in which they are formed |
— |
1999-01-05 |
| 5766974 |
Method of making a dielectric structure for facilitating overetching of metal without damage to inter-level dielectric |
Bruno Ricco |
1998-06-16 |
| 5641708 |
Method for fabricating conductive structures in integrated circuits |
Alexander Kalnitsky |
1997-06-24 |
| 5585308 |
Method for improved pre-metal planarization |
— |
1996-12-17 |
| 5424570 |
Contact structure for improving photoresist adhesion on a dielectric layer |
Alexander Kalnitsky, Charels R. Spinner, III, Robert Carlton Foulks, Sr. |
1995-06-13 |
| 5418398 |
Conductive structures in integrated circuits |
Alexander Kalnitsky |
1995-05-23 |
| 5406351 |
Photolithography system with improved illumination |
Gregory J. Stagaman |
1995-04-11 |
| 5310622 |
Method of patterning a reflective surface in an integrated circuit |
— |
1994-05-10 |