Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7247931 | Semiconductor package and leadframe therefor having angled corners | Ein Sun Ng, Yeu Wen Lee | 2007-07-24 |
| 7144538 | Method for making a direct chip attach device and structure | Yeu Wen Lee, Guan Keng Quah | 2006-12-05 |
| 7105378 | Method of forming a leadframe for a semiconductor package | Ein Sun Ng, Yeu Wen Lee | 2006-09-12 |