Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8674488 | Light emitting diode (LED) packages | Yong Lam Wai, Phang Hon Keat | 2014-03-18 |
| 8535988 | Large panel leadframe | Yong Lam Wai, Phang Hon Keat | 2013-09-17 |
| 8394675 | Manufacturing light emitting diode (LED) packages | Yong Lam Wai, Phang Hon Keat | 2013-03-12 |
| 8314479 | Leadframe package with recessed cavity for LED | Yong Lam Wai, Phang Hon Keat | 2012-11-20 |
| 7786554 | Stress-free lead frame | Lee Kock Huat, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu +3 more | 2010-08-31 |
| 7288833 | Stress-free lead frame | Lee Kock Huat, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu +3 more | 2007-10-30 |
| 6867483 | Stress-free lead frame | Lee Kock Huat, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu +3 more | 2005-03-15 |
| 6544817 | Method for sawing a moulded leadframe package | Lee Kock Huat, Phuah Kian Keung, Lee Huan Sin, Cheong Mun Tuck | 2003-04-08 |