Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8314481 | Substrate structure for an image sensor package and method for manufacturing the same | Chung-Hsien Hsin, Yves Huang, Kevin Chang | 2012-11-20 |
| 6642554 | Memory module structure | Nai Hua Yeh, Chen Peng, C. Cheng, Kuang-Yu Fan, Ren Long Kau +5 more | 2003-11-04 |
| 6501187 | Semiconductor package structure having central leads and method for packaging the same | Nai Hua Yeh, Chen Peng, Ching-Shui CHENG, Allis Chen | 2002-12-31 |