| 8552560 |
Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing |
Hemanshu Bhatt, Dilip Vijay, Jayanthi Pallinti, Sey-Shing Sun, Hong Ying |
2013-10-08 |
| 8076779 |
Reduction of macro level stresses in copper/low-K wafers |
Sey-Shing Sun, Jayanthi Pallinti, Dilip Vijay, Hemanshu Bhatt, Hong Ying +1 more |
2011-12-13 |
| 7531442 |
Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing |
Jayanthi Pallinti, Dilip Vijay, Hemanshu Bhatt, Sey-Shing Sun, Hong Ying +3 more |
2009-05-12 |
| 7205673 |
Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing |
Jayanthi Pallinti, Dilip Vijay, Hemanshu Bhatt, Sey-Shing Sun, Hong Ying |
2007-04-17 |
