| RE46671 |
Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device |
Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra +1 more |
2018-01-16 |
| 8847340 |
Packaged sensor structure having sensor opening and package opening aligned with sensor element |
Lorenzo Baldo, Mario Cortese |
2014-09-30 |
| 8796059 |
Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed |
Lorenzo Baldo, Mario Cortese |
2014-08-05 |
| 8546895 |
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type |
Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Lorenzo Baldo |
2013-10-01 |
| 8134214 |
Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates |
Lorenzo Baldo, Mario Cortese |
2012-03-13 |
| 8049287 |
Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device |
Benedetto Vigna, Federico Giovanni Ziglioli, Lorenzo Baldo, Manuela Magugliani, Ernesto Lasalandra +1 more |
2011-11-01 |
| 8043881 |
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type |
Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Lorenzo Baldo |
2011-10-25 |
| 8044929 |
Analog data-input device provided with a pressure sensor of a microelectromechanical type |
Lorenzo Baldo, Simone Sassolini, Marco Del Sarto |
2011-10-25 |
| 7928960 |
Analog input device with integrated pressure sensor and electronic apparatus equipped with said input device |
Lorenzo Baldo, Dino Faralli |
2011-04-19 |
| 7875942 |
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type |
Mario Cortese, Mark Anthony Azzopardi, Edward Myers, Lorenzo Baldo |
2011-01-25 |
| 7678600 |
Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate |
Flavio Francesco Villa, Pietro Corona, Lorenzo Baldo, Gabriele Barlocchi |
2010-03-16 |
| 7489004 |
Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness |
Andrea Rusconi Clerici Beltrami, Benedetto Vigna |
2009-02-10 |
| 7421904 |
Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device |
Federico Giovanni Ziglioli, Lorenzo Baldo, Caterina Riva, Mark Andrew Shaw |
2008-09-09 |
| 7343805 |
Surface acoustic wave pressure sensor |
Simona Petroni, Anna Angela Pomarico, Lorenzo Baldo |
2008-03-18 |
| 7322236 |
Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring device |
Lorenzo Baldo, Dino Faralli, Flavio Francesco Villa |
2008-01-29 |
| 7242066 |
Manufacturing method of a microelectromechanical switch |
Benedetto Vigna |
2007-07-10 |
| 7022542 |
Manufacturing method of a microelectromechanical switch |
Benedetto Vigna |
2006-04-04 |
| 6869856 |
Process for manufacturing a semiconductor wafer integrating electronic devices including a structure for electromagnetic decoupling |
Matteo Fiorito, Marta Mottura, Giuseppe Visalli, Benedetto Vigna |
2005-03-22 |