Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816485 | Methods and materials useful for chip stacking, chip and wafer bonding | Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal | 2014-08-26 |
| 8120168 | Methods and materials useful for chip stacking, chip and wafer bonding | Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal | 2012-02-21 |
| 7932161 | Methods and materials useful for chip stacking, chip and wafer bonding | Robert A. Shick, Hendra Ng, Andrew Bell, Wei Zhang, Phil Neal | 2011-04-26 |