Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8399776 | Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package | Bernd Karl Appelt, William T. Chen, Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen +1 more | 2013-03-19 |