Issued Patents All Time
Showing 25 most recent of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7066741 | Flexible circuit connector for stacked chip module | David Roper, James W. Cady | 2006-06-27 |
| 6919626 | High density integrated circuit module | — | 2005-07-19 |
| 6608763 | Stacking system and method | James Wilder, Julian Dowden | 2003-08-19 |
| 6572387 | Flexible circuit connector for stacked chip module | David Roper, James W. Cady | 2003-06-03 |
| 6310392 | Stacked micro ball grid array packages | — | 2001-10-30 |
| 6288907 | High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief | — | 2001-09-11 |
| 6205654 | Method of manufacturing a surface mount package | — | 2001-03-27 |
| 6194247 | Warp-resistent ultra-thin integrated circuit package fabrication method | James W. Cady, Jerry M. Roane, Phillip R. Troetschel | 2001-02-27 |
| 6190939 | Method of manufacturing a warp resistant thermally conductive circuit package | — | 2001-02-20 |
| 6168970 | Ultra high density integrated circuit packages | — | 2001-01-02 |
| 6049123 | Ultra high density integrated circuit packages | — | 2000-04-11 |
| 6025642 | Ultra high density integrated circuit packages | — | 2000-02-15 |
| 5978227 | Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends | — | 1999-11-02 |
| 5960539 | Method of making high density integrated circuit module | — | 1999-10-05 |
| 5945732 | Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package | — | 1999-08-31 |
| 5895232 | Three-dimensional warp-resistant integrated circuit module method and apparatus | — | 1999-04-20 |
| 5864175 | Wrap-resistant ultra-thin integrated circuit package fabrication method | — | 1999-01-26 |
| 5843807 | Method of manufacturing an ultra-high density warp-resistant memory module | — | 1998-12-01 |
| 5828125 | Ultra-high density warp-resistant memory module | — | 1998-10-27 |
| 5804870 | Hermetically sealed integrated circuit lead-on package configuration | — | 1998-09-08 |
| 5801437 | Three-dimensional warp-resistant integrated circuit module method and apparatus | — | 1998-09-01 |
| 5783464 | Method of forming a hermetically sealed circuit lead-on package | — | 1998-07-21 |
| 5778522 | Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief | — | 1998-07-14 |
| 5702985 | Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method | — | 1997-12-30 |
| 5654877 | Lead-on-chip integrated circuit apparatus | — | 1997-08-05 |