Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7497812 | Interactive computer simulation enhanced exercise machine | John D. Neff, Matthew Verona | 2009-03-03 |
| 7497807 | Interactive computer simulation enhanced exercise machine | John D. Neff, Matthew Verona | 2009-03-03 |
| 7334524 | Production vehicle for tritrack transportation system | — | 2008-02-26 |
| 7127999 | Tritrack system of mass transit | — | 2006-10-31 |
| 6970075 | Electronic programmable speed limiter | Peter Cherouny | 2005-11-29 |
| 6923124 | Tritrack system of mass transit | — | 2005-08-02 |
| 6194247 | Warp-resistent ultra-thin integrated circuit package fabrication method | Carmen D. Burns, James W. Cady, Phillip R. Troetschel | 2001-02-27 |
| 5873844 | Method and apparatus for numbing tissue before inserting a needle | Manuel Campero | 1999-02-23 |
| 5592364 | High density integrated circuit module with complex electrical interconnect rails | — | 1997-01-07 |
| 5588205 | Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails | — | 1996-12-31 |
| 5581121 | Warp-resistant ultra-thin integrated circuit package | Carmen D. Burns, James W. Cady, Phillip R. Troetschel | 1996-12-03 |
| 5550711 | Ultra high density integrated circuit packages | Carmen D. Burns, James W. Cady | 1996-08-27 |
| 5498906 | Capacitive coupling configuration for an intergrated circuit package | Carmen D. Burns | 1996-03-12 |
| 5475920 | Method of assembling ultra high density integrated circuit packages | Carmen D. Burns, James W. Cady | 1995-12-19 |
| 5446620 | Ultra high density integrated circuit packages | Carmen D. Burns, James W. Cady | 1995-08-29 |
| 5367766 | Ultra high density integrated circuit packages method | Carmen D. Burns, James W. Cady | 1994-11-29 |
| 5369056 | Warp-resistent ultra-thin integrated circuit package fabrication method | Carmen D. Burns, James W. Cady, Phillip R. Troetschel | 1994-11-29 |
| 5369058 | Warp-resistent ultra-thin integrated circuit package fabrication method | Carmen D. Burns, James W. Cady, Philip R. Troetschel | 1994-11-29 |
| 5236117 | Impact solder method and apparatus | Carmen D. Burns | 1993-08-17 |