JR

Jerry M. Roane

ST Staktek: 10 patents #2 of 5Top 40%
CU Cubex: 2 patents #3 of 14Top 25%
SG Staktek Group: 1 patents #14 of 25Top 60%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
Overall (All Time): #241,443 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7497812 Interactive computer simulation enhanced exercise machine John D. Neff, Matthew Verona 2009-03-03
7497807 Interactive computer simulation enhanced exercise machine John D. Neff, Matthew Verona 2009-03-03
7334524 Production vehicle for tritrack transportation system — 2008-02-26
7127999 Tritrack system of mass transit — 2006-10-31
6970075 Electronic programmable speed limiter Peter Cherouny 2005-11-29
6923124 Tritrack system of mass transit — 2005-08-02
6194247 Warp-resistent ultra-thin integrated circuit package fabrication method Carmen D. Burns, James W. Cady, Phillip R. Troetschel 2001-02-27
5873844 Method and apparatus for numbing tissue before inserting a needle Manuel Campero 1999-02-23
5592364 High density integrated circuit module with complex electrical interconnect rails — 1997-01-07
5588205 Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails — 1996-12-31
5581121 Warp-resistant ultra-thin integrated circuit package Carmen D. Burns, James W. Cady, Phillip R. Troetschel 1996-12-03
5550711 Ultra high density integrated circuit packages Carmen D. Burns, James W. Cady 1996-08-27
5498906 Capacitive coupling configuration for an intergrated circuit package Carmen D. Burns 1996-03-12
5475920 Method of assembling ultra high density integrated circuit packages Carmen D. Burns, James W. Cady 1995-12-19
5446620 Ultra high density integrated circuit packages Carmen D. Burns, James W. Cady 1995-08-29
5367766 Ultra high density integrated circuit packages method Carmen D. Burns, James W. Cady 1994-11-29
5369056 Warp-resistent ultra-thin integrated circuit package fabrication method Carmen D. Burns, James W. Cady, Phillip R. Troetschel 1994-11-29
5369058 Warp-resistent ultra-thin integrated circuit package fabrication method Carmen D. Burns, James W. Cady, Philip R. Troetschel 1994-11-29
5236117 Impact solder method and apparatus Carmen D. Burns 1993-08-17