Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9918384 | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof | Dirk Baars, Dale J. Doyle, Sankar Paul, Diana J. Williams | 2018-03-13 |
| 8809690 | Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof | Dirk Baars, Dale J. Doyle, Sankar Paul, Diana J. Williams | 2014-08-19 |
| 7722950 | Adhesive compositions for flexible circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof | David H. Guo | 2010-05-25 |
| 7180172 | Circuits, multi-layer circuits, and methods of manufacture thereof | Murali Sethumadhavan, Scott D. Kennedy | 2007-02-20 |
| 6555255 | Polymeric organic coatings and method of manufacture thereof | Thomas A. P. Seery, Hanrong Gao, Jayanthi Jacob | 2003-04-29 |
| 5413687 | Method for metallizing fluoropolymer substrates | Robert B. McGraw | 1995-05-09 |
| 5287619 | Method of manufacture multichip module substrate | W. David Smith, John Albert Olenick, Jane L. Cercena, Daniel J. Navarro, Kathleen Ritter Olenick +12 more | 1994-02-22 |
| 4915981 | Method of laser drilling fluoropolymer materials | Richard T. Traskos, Cathy Fleischer, David B. Noddin | 1990-04-10 |
| 4812213 | Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom | Adrienne Lindsay, Samuel W. Henson | 1989-03-14 |
| 4546118 | Epoxy foam | Scott S. Simpson, Anthony Yeznach | 1985-10-08 |