Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6194024 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more | 2001-02-27 |
| 6134772 | Via fill compositions for direct attach of devices and methods of applying same | Roy Lynn Arldt, Christina M. Boyko, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more | 2000-10-24 |
| 5766670 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more | 1998-06-16 |
| 5571593 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Richard Michael Kozlowski, Joseph Duane Kulesza, John M. Lauffer +7 more | 1996-11-05 |
| 5214250 | Method of reworking circuit panels, and circuit panels reworked thereby | John A. Covert, Steven A. Duncan, John M. Lauffer, Issa S. Mahmoud, Richard A. Schumacher | 1993-05-25 |