Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510628 | Contact pads for electrical module assembly with multidimensional transducer arrays | Stephen R. Barnes, David A. Petersen | 2019-12-17 |
| 9818703 | Printed circuit board | Jaegwon Jang, Youngjae Kim | 2017-11-14 |
| 9601466 | Semiconductor package and method of manufacturing the same | Jeongwon Yoon, Boin Noh, Hyunsuk Chun | 2017-03-21 |