| 5622305 |
Bonding scheme using group VB metallic layer |
Donald D. Bacon, Cheng-Hsuan Chen, Ho S. Chen, King Lien Tai |
1997-04-22 |
| 5486263 |
Etching a diamond body with a molten or partially molten metal |
William C. Dautremont-Smith, John Edwin Graebner, Sungho Jin |
1996-01-23 |
| 5334306 |
Metallized paths on diamond surfaces |
William C. Dautremont-Smith, Leonard C. Feldman, Rafael Kalish, Barry Miller, Netzer Moriya |
1994-08-02 |
| 5234153 |
Permanent metallic bonding method |
Donlad D. Bacon, Chien-Hsun Lee, King Lien Tai, Yiu-Man Wong |
1993-08-10 |
| 5234149 |
Debondable metallic bonding method |
Chien-Hsun Lee, King Lien Tai |
1993-08-10 |
| 5232873 |
Method of fabricating contacts for semiconductor devices |
Michael Geva |
1993-08-03 |
| 5230145 |
Assembly including patterned diamond film submount with self-aligned laser device |
David I. Caplan |
1993-07-27 |
| 5197654 |
Bonding method using solder composed of multiple alternating gold and tin layers |
Chien-Hsun Lee, King Lien Tai, Yiu-Man Wong |
1993-03-30 |
| 5100836 |
Method of making a semiconductor device |
William C. Dautremont-Smith, Louis A. Koszi, Bryan P. Segner, Peter Thomas |
1992-03-31 |
| 5089438 |
Method of making an article comprising a TiN.sub.x layer |
— |
1992-02-18 |
| 5036023 |
Rapid thermal processing method of making a semiconductor device |
William C. Dautremont-Smith, Louis A. Koszi, Bryan P. Segner, Peter Thomas |
1991-07-30 |