Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812108 | BICMOS process with low temperature coefficient resistor (TCRL) | Donald F. Hemmenway, Jose Avelino Delgado, John Butler, Michael D. Church, George V. Rouse +2 more | 2004-11-02 |
| 6798024 | BiCMOS process with low temperature coefficient resistor (TCRL) | Donald F. Hemmenway, Jose Avelino Delgado, John Butler, Michael D. Church, George V. Rouse +2 more | 2004-09-28 |
| 6551897 | Wafer trench article and process | Patrick A. Begley, Donald F. Hemmenway, George Bajor, Jeanne M. McNamara, Michael Sean Carmody +1 more | 2003-04-22 |
| 6492705 | Integrated circuit air bridge structures and methods of fabricating same | Patrick A. Begley, William R. Young, Jose Avelino Delgado, Stephen Joseph Gaul | 2002-12-10 |
| 6365953 | Wafer trench article and process | Patrick A. Begley, Donald F. Hemmenway, George Bajor, Jeanne M. McNamara, Michael Sean Carmody +1 more | 2002-04-02 |
| 6351021 | Low temperature coefficient resistor (TCRL) | Donald F. Hemmenway, Jose Avelino Delgado, John Butler | 2002-02-26 |
| 6211056 | Integrated circuit air bridge structures and methods of fabricating same | Patrick A. Begley, William R. Young, Jose Avelino Delgado, Stephen Joseph Gaul | 2001-04-03 |
| 5994204 | Silicon-glass bonded wafers | William R. Young | 1999-11-30 |
| 5933746 | Process of forming trench isolation device | Patrick A. Begley, Donald F. Hemmenway, George Bajor, Jeanne M. McNamara, Michael Sean Carmody +1 more | 1999-08-03 |
| 5892264 | High frequency analog transistors, method of fabrication and circuit implementation | Christopher K. Davis, George Bajor, James D. Beasom, Thomas L. Crandell, Taewon Jung | 1999-04-06 |
| 5807780 | High frequency analog transistors method of fabrication and circuit implementation | Christopher K. Davis, George Bajor, James D. Beasom, Thomas L. Crandell, Taewon Jung | 1998-09-15 |
| 5773151 | Semi-insulating wafer | Patrick A. Begley, Gyorgy Bajor, Rex Lowther | 1998-06-30 |
| 5729038 | Silicon-glass bonded wafers | William R. Young | 1998-03-17 |
| 5668397 | High frequency analog transistors, method of fabrication and circuit implementation | Christopher K. Davis, George Bajor, James D. Beasom, Thomas L. Crandell, Taewon Jung | 1997-09-16 |
| 5585661 | Sub-micron bonded SOI by trench planarization | Craig J. McLachlan | 1996-12-17 |
| 5504033 | Method for forming recessed oxide isolation containing deep and shallow trenches | George Bajor | 1996-04-02 |
| 5395774 | Methods for forming a transistor having an emitter with enhanced efficiency | George Bajor, Jack H. Linn | 1995-03-07 |
| 5382541 | Method for forming recessed oxide isolation containing deep and shallow trenches | George Bajor | 1995-01-17 |
| 5066995 | Double level conductor structure | William R. Young | 1991-11-19 |
| 5021359 | Radiation hardened complementary transistor integrated circuits | William R. Young, William W. Wiles, Jr. | 1991-06-04 |
| 4914501 | Vertical contact structure | William R. Young | 1990-04-03 |
| 4903108 | Radiation hardened complementary transistor integrated circuits | William R. Young, William W. Wiles, Jr. | 1990-02-20 |
| 4851257 | Process for the fabrication of a vertical contact | William R. Young | 1989-07-25 |
| 4760433 | ESD protection transistors | W. Ronald Young, John T. Gasner | 1988-07-26 |
| 4705597 | Photoresist tapering process | George E. Gimpelson, Cheryl L. Holbrook | 1987-11-10 |