AV

Al Vindasius

VC Vertical Circuits: 3 patents #4 of 20Top 20%
IN Invensas: 1 patents #115 of 142Top 85%
Overall (All Time): #1,219,549 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8729690 Assembly having stacked die mounted on substrate Marc E. Robinson, Larry Jacobsen, Donald Almen 2014-05-20
7705432 Three dimensional six surface conformal die coating Marc E. Robinson 2010-04-27
7245021 Micropede stacked die component assembly Marc E. Robinson, Larry Jacobsen, Donald Almen 2007-07-17
7215018 Stacked die BGA or LGA component assembly Marc E. Robinson, Larry Jacobsen, Donald Almen 2007-05-08