Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803653 | Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability | Robert E. Likins, Richard C. Blish, II, Sharad M. Shah, Devendra Natekar | 2004-10-12 |