Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8163645 | Method for providing a redistribution metal layer in an integrated circuit | Danielle A. Thomas, Harry Michael Siegel, Anthony M. Chiu | 2012-04-24 |
| 7786582 | System for providing a redistribution metal layer in an integrated circuit | Danielle A. Thomas, Harry Michael Siegel, Anthony M. Chiu | 2010-08-31 |
| 6825551 | Method for packaging a semiconductor chip containing sensors and resulting package | — | 2004-11-30 |