NA

Nisha Ananthakrisnan

IN Intel: 1 patents #18,218 of 30,777Top 60%
📍 Chandler, AZ: #2,136 of 3,331 inventorsTop 65%
🗺 Arizona: #18,403 of 32,909 inventorsTop 60%
Overall (All Time): #3,147,862 of 4,157,543Top 80%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
8377550 Flip chip package containing novel underfill materials Rajasekaran Swaminathan, Hong Dong, Sandeep Razdan, Rahul N. Manepalli 2013-02-19