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Backside-thinned image sensor using Al2 O3 surface passivation |
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2015-03-10 |
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Collimator bonding structure and method |
Kenneth Costello, Kevin Roderick, Douglas Fowler |
2014-04-15 |
| 7479686 |
Backside imaging through a doped layer |
Kenneth Costello, Kevin Fairbairn, David Ward Brown, Yun H. Chung, Patricia Gober |
2009-01-20 |
| 7042060 |
Backside thinning of image array devices |
Kenneth Costello, Kevin Fairbairn, David Ward Brown, Yun H. Chung, Patricia Gober |
2006-05-09 |
| 7005637 |
Backside thinning of image array devices |
Kenneth Costello, Kevin Fairbairn, David Ward Brown, Yun H. Chung, Patricia Gober |
2006-02-28 |
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Multi-beam multi-column electron beam inspection system |
Alan D. Brodie, N. William Parker, Frank Tsai |
2005-12-20 |
| 6844550 |
Multi-beam multi-column electron beam inspection system |
Alan D. Brodie, N. William Parker, Frank Tsai |
2005-01-18 |
| 6777675 |
Detector optics for electron beam inspection system |
N. William Parker, Frank Tsai |
2004-08-17 |
| 6617587 |
Electron optics for multi-beam electron beam lithography tool |
N. William Parker, Alan D. Brodie, George Xinsheng Guo, Michael C. Matter |
2003-09-09 |