Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5927853 | Method for thermal impedance evaluation of packaged semiconductor components | Filip Christiaens, Luc De Schepper, Eric Beyne | 1999-07-27 |
| 5795063 | Method and apparatus for thermal impedance evaluation of packaged semiconductor components | Filip Christiaens, Luc De Schepper, Eric Beyne | 1998-08-18 |