Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7291548 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Mitesh Patel, Tiffany Byrne +4 more | 2007-11-06 |
| 7253088 | Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same | Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Mitesh Patel, Tiffany Byrne +4 more | 2007-08-07 |